JPS62157162U - - Google Patents
Info
- Publication number
- JPS62157162U JPS62157162U JP4498786U JP4498786U JPS62157162U JP S62157162 U JPS62157162 U JP S62157162U JP 4498786 U JP4498786 U JP 4498786U JP 4498786 U JP4498786 U JP 4498786U JP S62157162 U JPS62157162 U JP S62157162U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thickness
- substrate
- switching diode
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4498786U JPS62157162U (en]) | 1986-03-27 | 1986-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4498786U JPS62157162U (en]) | 1986-03-27 | 1986-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62157162U true JPS62157162U (en]) | 1987-10-06 |
Family
ID=30863314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4498786U Pending JPS62157162U (en]) | 1986-03-27 | 1986-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62157162U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192037A (en) * | 1981-05-22 | 1982-11-26 | Hitachi Ltd | Semiconductor device |
-
1986
- 1986-03-27 JP JP4498786U patent/JPS62157162U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192037A (en) * | 1981-05-22 | 1982-11-26 | Hitachi Ltd | Semiconductor device |